Baugruppentechnologie der Elektronik: Montage. Front Cover. Hans-Joachim Hanke, Wolfgang Scheel. Verlag Technik, – pages. Baugruppentechnologie der Elektronik: Leiterplatten. Front Cover. Hans-Joachim Hanke, Wolfgang Scheel. Verlag Technik, – Printed circuits – pages. 1 ] Hanke. H. J. (Editor): ‘ Baugruppentechnologie der Elektronik-Hybridtrager’. – Berlin: Verlag Technik,  Scheel, W. (Editor): ‘Baugruppentechnologie.
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Three different wire types were bonded on two different Al pad metallization with optimized bonding parameter, stressed by high temperature storage NTS conditions at degC up to hours and baugruppentehnologie by light microscopy LMscanning electron microscopy SEM in addition to energy dispersive X-ray analysis EDX.
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